P R O D U C T S
1099nm Nanosecond laser
Laser Stealth Dicing is a non-contact cutting technique that can cut semiconductor materials accurately and efficiently. The wafer Stealth Dicing laser introduced by Precilasers has achieved high quality stealth dicing on a variety of wafer materials. The infrared laser’s pulse width and waveform can be adjusted, also feature with pulse width and repetition rate be adjusted continuouly, to achieve accurate processing of the wafer.
Features
- High Power
- Waveform Can Be Edited
- Good Beam Quality
- Pulse Width Adjustable
- Repetion Rate Asjustable
Application
- Wafer Stealth Dicing
Main parameters
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Specification |
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Partnumber |
FL-NSF-1099-20-QCW |
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Center Wavelength |
1099nm |
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Pulse Width |
100-800ns（adjustable） |
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Repetition Rate |
50-200kHz（adjustable） |
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Average Power |
10W |
20W |
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Beam Diameter |
3±0.2mm |
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Beam Divergence (full angle) |
<0.5mrad |
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Beam Circularity |
＞95% |
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Beam Quality |
TEM00，M²<1.2 |
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Polarization |
linear,>20dB |
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Power Stability |
<0.3% @3hours, RMS |
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Waveform |
Gaussian/Square waveform |
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Cooling |
Water cooling |
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Warm-Up Time |
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Cold Start |
<2 hours |
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Warm Start |
<15 minutes |
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Demension and Weight |
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Controller Size |
≤483mm x 422mm x 105mm |
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Laser Head Size |
≤68.5mm x 278mm x 46mm |
≤520mm x 200mm x 95mm |
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Chiller Size |
≤58cm x 29cm x 52cm |
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Laser Head Weight |
≤10kg |
≤15kg |
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Laser Controller Weight |
≤20kg |
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Chiller Weight |
≤25kg |
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Cable Length Between Laser Head And Controller |
fiber length>2m |
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Environment and Power Supply |
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Operating Temperature（No condensing） |
15-35 ℃（water cooling） |
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Power Supply |
100V-240V, AC, 50/60Hz |
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Power Consumption |
<200W |
<250W |
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Communication |
RS422 |
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Higher power, more wavelengths, customizable solutions
